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IEEE Transactions on Electromagnetic Compatibility > 2018 > 60 > 2 > 487 - 496
IEEE Transactions on Electromagnetic Compatibility > 2018 > 60 > 1 > 7 - 15
IEEE Transactions on Electromagnetic Compatibility > 2018 > 60 > 1 > 77 - 85
IEEE Journal of Solid-State Circuits > 2018 > 53 > 1 > 297 - 308
IEEE Transactions on Sustainable Energy > 2018 > 9 > 1 > 74 - 85
IEEE Transactions on Computer-Aided Design of Integrated Circuits and... > 2018 > 37 > 1 > 231 - 244
IEEE Microwave and Wireless Components Letters > 2017 > 27 > 12 > 1092 - 1094
IEEE Transactions on Device and Materials Reliability > 2017 > 17 > 4 > 600 - 607
IEEE Transactions on Electron Devices > 2017 > 64 > 12 > 4992 - 5000
IEEE Transactions on Electron Devices > 2017 > 64 > 12 > 4928 - 4936
IEEE Transactions on Device and Materials Reliability > 2017 > 17 > 4 > 636 - 642
IEEE Electron Device Letters > 2017 > 38 > 12 > 1767 - 1770
IEEE Transactions on Device and Materials Reliability > 2017 > 17 > 4 > 653 - 666
IEEE Transactions on Microwave Theory and Techniques > 2017 > 65 > 12-1 > 4794 - 4801
TENCON 2017 - 2017 IEEE Region 10 Conference > 2683 - 2686
IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2017 > 25 > 11 > 3089 - 3098
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 11 > 1842 - 1851